Small Outline Package (SOP)

The Standard for Compact IC Packaging

TSOP (Thin Small Outline Package)

A thinner version for memory ICs.

SSOP (Shrink Small Outline Package)

A reduced footprint for higher density.

TSSOP (Thin Shrink Small Outline)

Used for compact, low-power applications.

Delivering cost-effective and reliable IC packaging solutions.

What is a Small Outline Package (SOP)?

SOP is a compact IC packaging design with leads extending from both sides. It is a smaller version of DIP, designed for surface mounting on PCBs.

Developed in the 1980s to meet the demand for compact electronic designs

Definition

Advantages

Compact, lightweight, and suitable for high-speed automated assembly.

Key Features

Compact design for space-saving on PCBs.
Enhanced thermal performance.
Compatibility with automated assembly processes.

Consumer electronics like smartphones and tablets.

iPad near sunglasses, wallet, and DSLR camera

iPad near sunglasses, wallet, and DSLR camera

the dashboard of a car with a gps device

the dashboard of a car with a gps device

people wearing surgical clothes inside operating room

people wearing surgical clothes inside operating room

Automotive control systems

Medical devices.

Predict the future by creating it

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