IC Packaging Solutions

Leading provider of innovative IC packaging solutions, ensuring reliability and performance in semiconductor technology.

Advanced Technology Solutions

We specialize in cutting-edge QFN, QFP, and SOP packaging to meet diverse client needs.

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gray industrial machine
Research and Development

Continuous investment in R&D to stay ahead in the evolving semiconductor landscape and drive innovation.

Trusted Partner for Clients

Our commitment to excellence establishes us as a reliable partner for advanced IC packaging solutions.
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a computer chip with the letter a on top of it
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human hand neon signage

IC Packaging

Explore our advanced semiconductor solutions and innovative packaging technologies.

Dual In-line Package (DIP)

Small Outline Package (SOP)

Quad Flat Package (QFP)

Ball Grid Array (BGA)

Chip-Scale Package (CSP)

Quad Flat No-Lead (QFN)

Thin Small Outline Package (TSOP)

Plastic Leaded Chip Carrier (PLCC)

Land Grid Array (LGA)

Silronex Resources consistently delivers exceptional quality and reliability in IC packaging solutions. Highly recommended!

Rajesh Kumar

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a wallet sitting on top of a wooden bench
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a group of square objects

★★★★★

Innovation

Leading IC packaging solutions for semiconductor industry.

Expertise

Info@silitronex.com

+91 86601 60366

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