What is a Quad Flat Package (QFP)?

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History

Developed in the late 1980s to meet the demand for compact and high-performance electronic devices..

Advantages

Supports high-speed applications, reduces lead inductance, and is compatible with automated assembly..

QFP Packaging Features

Explore the key features of QFP packaging for advanced electronic applications and designs.

High Pin Count

Ideal for complex designs requiring numerous connections in compact spaces.

Space-Saving Design

Low profile allows efficient use of space on printed circuit boards.

Thermal Performance

Ensures excellent thermal and electrical performance for reliable operation in devices.

Where Are QFP ICs Used?

• Microprocessors and microcontrollers.

• Consumer electronics: TVs, gaming consoles, and smartphones.

• Automotive and industrial control systems.

QFP Variants

Explore various types of QFP packaging for your projects.

TQFP (Thin Quad Flat Package)

Designed for compact, low-profile applications in electronics.

PQFP (Power Quad Flat Package)

Offers superior thermal performance for high-power applications.

Plastic Leaded Chip Carrier (PLCC)

Durable plastic design suited for various electronic devices.

QFP Comparison

Detailed comparison on size, pin count, and applications.

Explore Innovative QFP IC Solutions Today

Contact us to discover cutting-edge QFP IC solutions for your next project.

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