Revolutionizing Semiconductor Packaging Solutions
At the forefront of TSOP technology, we specialize in innovative semiconductor packaging that enhances performance and efficiency for modern electronic devices.
THIN SMALL OUTLINE PACKAGE
TSOP Innovation
TSOP, or Thin Small Outline Package, is a compact IC packaging solution widely used in memory devices like DRAM, SRAM, and flash memory. Its slim profile and lightweight design make it ideal for space-constrained electronic devices.


Key Features








Slim Form Factor
Minimal height, ideal for compact designs.
High Pin Count
Supports dense connectivity in small spaces.
Cost-Effective
Economical for mass production.
Thermal Efficiency
Enhanced heat dissipation..
Where is TSOP Used?
Memory Modules: DRAM, Flash, and SRAM.
Consumer Electronics: Smartphones, laptops, and cameras.
Embedded Systems: Microcontrollers and processors.
IoT Devices: Compact and portable electronics.
Types of TSOP Packaging
TSOP-II
Leads on the longer sides.
Suitable for SRAM and DRAM.


TSOP-I
Leads on the shorter sides.
Commonly used in Flash memory.


Innovation
Leading IC packaging solutions for semiconductor industry.
Expertise
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