TSOP Innovation

TSOP, or Thin Small Outline Package, is a compact IC packaging solution widely used in memory devices like DRAM, SRAM, and flash memory. Its slim profile and lightweight design make it ideal for space-constrained electronic devices.

Key Features

Slim Form Factor

Minimal height, ideal for compact designs.

High Pin Count

Supports dense connectivity in small spaces.

Cost-Effective

Economical for mass production.

Thermal Efficiency

Enhanced heat dissipation..

Where is TSOP Used?

• Memory Modules: DRAM, Flash, and SRAM.

• Consumer Electronics: Smartphones, laptops, and cameras.

• Embedded Systems: Microcontrollers and processors.

• IoT Devices: Compact and portable electronics.

Types of TSOP Packaging

TSOP-II

• Leads on the longer sides.

• Suitable for SRAM and DRAM.

TSOP-I

• Leads on the shorter sides.

• Commonly used in Flash memory.