Revolutionizing Semiconductor Packaging Solutions

At the forefront of TSOP technology, we specialize in innovative semiconductor packaging that enhances performance and efficiency for modern electronic devices.

THIN SMALL OUTLINE PACKAGE

TSOP Innovation

TSOP, or Thin Small Outline Package, is a compact IC packaging solution widely used in memory devices like DRAM, SRAM, and flash memory. Its slim profile and lightweight design make it ideal for space-constrained electronic devices.

Key Features

Slim Form Factor

Minimal height, ideal for compact designs.

High Pin Count

Supports dense connectivity in small spaces.

Cost-Effective

Economical for mass production.

Thermal Efficiency

Enhanced heat dissipation..

Where is TSOP Used?

flat lay photography of circuit board
flat lay photography of circuit board
closeup photography of audio mixer
closeup photography of audio mixer
a close up of a computer motherboard with many components
a close up of a computer motherboard with many components
  • Memory Modules: DRAM, Flash, and SRAM.

  • Consumer Electronics: Smartphones, laptops, and cameras.

  • Embedded Systems: Microcontrollers and processors.

  • IoT Devices: Compact and portable electronics.

Types of TSOP Packaging

TSOP-II
  • Leads on the longer sides.

  • Suitable for SRAM and DRAM.

TSOP-I
  • Leads on the shorter sides.

  • Commonly used in Flash memory.