Innovating Precision in IC Packaging

At the forefront of advanced packaging technology, we specialize in Land Grid Array (LGA) solutions that ensure high performance and reliability for electronic applications across various industries.

Our Mission Statement

Why Choose Our Solutions?

We are dedicated to delivering cutting-edge LGA technology, enhancing the efficiency and reliability of electronic devices, while meeting the evolving needs of our clients in a competitive market.

A Land Grid Array (LGA) is a type of surface-mount packaging for integrated circuits (ICs). Unlike traditional packages with pins, LGA uses flat contacts or lands on the underside of the package, which connect to a printed circuit board (PCB).

• Provides robust electrical and mechanical connections.

• Ideal for high-performance applications like CPUs and networking equipment.

• Compatible with automated assembly processes.

Key Features of LGA Packaging

Compact Design

Optimized for high-density PCBs.

Flat Contacts

Eliminates fragile pins, improving durability.

Thermal Efficiency

Superior heat dissipation for high-power applications.

Electrical Performance

Reliable signal integrity with low resistance.

Precision Packaging Solutions

Explore advanced LGA technology for reliable and high-performance electronic applications in various industries.

Network Equipment

While it's more commonly associated with processors its role in network equipment like Routers, switches, and modems. involves specialized processors and ICs.

Microprocessors

A microprocessor, like a CPU (Central Processing Unit) or a GPU (Graphics Processing Unit), is the core processing unit within a computer or server, responsible for executing instructions and performing calculations.

LGA (Land Grid Array) small size and efficient design make them ideal for space-constrained IoT applications like wearables, smart home devices, and industrial sensors. With robust connectivity and cost-effective assembly, LGAs are key to scalable IoT innovation.

IoT Devices

Automotive Electronics

They are used in modules like engine control units (ECUs), advanced driver assistance systems (ADAS), and connectivity solutions for smart vehicles. Their small size, thermal efficiency, and reliable connectivity make them ideal for space-constrained.

LGA Packaging Solutions

We offer various LGA packaging options for enhanced performance and easy upgrades in processors.

Socketed LGA Options

Facilitates easy processor upgrades and replacements for improved system performance.

Soldered LGA Solutions

Provides robust connections for reliable and long-lasting performance in electronic devices.

Flip-Chip LGA Design

Combines LGA with flip-chip bonding for superior performance and efficiency in applications.