BALL GRID ARRAY (BGA)

The Gold Standard for High Density IC Packaging

Maximizing performance, minimizing space.

What is a Ball Grid Array (BGA)?

A Ball Grid Array (BGA) is a type of IC packaging that uses solder balls arranged in a grid pattern on the underside of the package. This design replaces traditional leads and allows for more pins in a compact area, making it ideal for advanced electronic applications.

Developed to improve electrical and thermal performance compared to traditional IC packages with leads.

Key Features of BGA

Compact Design

Supports high pin density in minimal space.

two square blue LED lights

two square blue LED lights

High Performance

Improved electrical and thermal properties.

Excellent mechanical strength and low resistance.

Reliable Connections

Innovative Solutions for Modern Technology

lighted black and gray graphics card

lighted black and gray graphics card

blue and grey corded electronic device on top of black device

blue and grey corded electronic device on top of black device

macro shot photo of a computer RAM

macro shot photo of a computer RAM

the dashboard of a car with a gps device

the dashboard of a car with a gps device

Microprocessors and GPUs: Powering computing and graphical applications.
Memory Modules: Found in DRAM, Flash, and SSDs.
Networking Devices: Routers, switches, and communication equipment.
Automotive and Industrial Systems: Used in control units and embedded systems.

Variants of BGA Packaging

uBGA (Micro BGA)

Smaller solder ball pitch for compact devices.

TBGA (Thin BGA)

Thinner profile for low-height designs.

PBGA (Plastic BGA)

Cost-effective solution for high-volume production.

CBGA (Ceramic BGA)

Enhanced thermal and mechanical properties.