Revolutionizing IC Packaging

Explore the future of ultra-compact chip-scale packages for advanced technology and innovative applications.

What is a Chip-Scale Package (CSP)?

A Chip-Scale Package (CSP) is an advanced type of IC packaging where the chip and package size are almost identical, providing the most compact form factor available today.

• Compact and lightweight design.

• High-performance capabilities.

• Ideal for portable and wearable electronics.

Advantages

Introduced to support miniaturized electronics like smartphones and IoT devices.

Key Features of CSP

Ultra-Compact Design

Nearly the same size as the chip.

High-Speed Performance

Low electrical resistance and high signal integrity.

Lightweight and Portable

Ideal for mobile devices.

Cost-Effective

Supports mass production with automated assembly.

Where Are CSP ICs Used?

• Smartphones and Tablets: Core processors and memory modules.

• Wearable Devices: Smartwatches, fitness trackers, and medical sensors.

• IoT Devices: Smart home gadgets and industrial sensors.

• Automotive Electronics: Engine management and vehicle connectivity systems.

Types of CSP Packages

FC-CSP (Flip-Chip CSP)

High-performance version using flip-chip bonding.

WL-CSP (Wafer-Level CSP)

Manufactured directly on the wafer for maximum miniaturization.

Leadframe CSP

Combines lead frames and chip-scale design for low-cost production

Get in Touch with Us

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